Wylie BGA Reballing Stencil For iPhone - For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max

Description

Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips. Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight. Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate. The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation - For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max

Specifications

SKU

APP19775

Quality

OEM Quality